Body

Specifications

• Model Number: {manufacturers_part_number}
• Manufacturer: Morgan Mfg Inc.
• Type: Modular Component Body
• Material: High-grade aluminum alloy
• Weight: 0.5 lbs
• Dimensions: 4.0 x 3.0 x 2.0 inches
• Finish: Matte black powder coat

Key Features

• Precision Engineering: Manufactured to tight tolerances for consistent fit and reliable performance, ensuring seamless integration into diverse systems.
• Durable Construction: Crafted from robust aluminum alloy, providing excellent resistance against wear, minor impacts, and environmental factors.
• Modular Design: Features standardized mounting points and universal interfaces, facilitating easy assembly and versatile application with other components.
• Optimized Thermal Management: Engineered to support passive heat dissipation, contributing to the longevity and stable operation of internal electronics.
• Lightweight Profile: The low mass design minimizes the overall product weight, making it suitable for portable or weight-sensitive applications without compromising structural integrity.

Applications

• Electronic Device Enclosures: Ideal for housing printed circuit boards, sensors, and small electronic assemblies, offering both protection and a professional finish.
• Industrial Control Units: Functions as a protective shell for compact control systems, timers, and small relays in automated machinery environments.
• Prototyping and Development: Serves as a versatile foundation for developing new products, allowing for rapid iteration and testing of internal components.
• Measurement and Sensing Equipment: Provides a secure and stable housing for environmental sensors, data loggers, and portable diagnostic tools.
• Mounting and Structural Support: Can be utilized as a foundational element for mounting various components, ensuring stability and precise alignment within larger systems.

Benefits

• Enhanced Component Protection: Shields delicate internal components from dust, moisture, and physical damage, extending product lifespan and reducing maintenance requirements.
• Simplified Assembly Process: Standardized dimensions and mounting features streamline assembly, reducing manufacturing time and increasing production efficiency.
• Increased System Reliability: The robust construction and effective thermal management contribute to consistent and dependable operation of housed electronics.
• Versatile Integration: Its modular nature allows for broad applicability across diverse projects, offering flexibility in design and deployment strategies.
• Reduced Total Weight: The lightweight material choice contributes to lighter end products, potentially lowering shipping costs and improving portability for end-users.